Test Inspection Laboratory
Test Inspection Laboratory Services is the latest addition to Omega GTI’s offerings. We’re fully equipped to testing with the most advanced in-house tools to verify component authenticity.
Omega’s counterfeit detection verifies component authenticity. The integrity of your material is always confirmed, allowing for a smooth line operation and peace of mind. You now have access to Real-Time X-ray Inspection System capable of supporting their testing needs, including: Electronic assemblies, PCB Boards, and General Failure Analysis. Here are some equipment we use to screen your material.
Counterfeit Detection
Visual Inspection
This ensures that components conforms with OCM datasheet and MIL-STD-883 from packaging up to the component level utilizing the most advanced digital microscope with 20X~2500X magnification.
X-ray Inspection
Widely considered as a non-destructive test following MIL-STD-883 used to verify internal condition of the lead frame, die condition and wire bonds.
Lead Finish EVAL/XRF Analysis
XRF is a non-destructive analytical technique used to determine the elemental composition of materials mainly for RoHS compliance.
Decapsulation
A destructive test using the latest laser decapsulation technology that replaces traditional chemical etching processes. This provides fast and accurate solutions for IC de-capsulation and de-lidding, expose the insides from ceramic, KOVAR, gel, and mold compound capsulation, expose defective bonding wires, observe solder ball mid-position and lamination cracks, and more evidence of failure.
Solderability
A destructive test to determine component leads/pads are free from oxidation and can still meet MIL-STD-883 and IPC-610 requirements.
Baking & Vacuum Sealing
Compromised moisture sensitive devices are subjected for baking to bring the components to a dry condition following OCM requirements and vacuum sealed with nitrogen purge system to flush out package moisture to protect and extend the life of moisture sensitive materials.
