Our Laboratory
Earning Your Trust, One Component at a Time
With years of expertise, Omega GTI’s Test Inspection Laboratory Services is your trusted partner for component authenticity verification. Our advanced in-house tools and counterfeit detection methods guarantee the integrity of your materials, ensuring seamless operations and peace of mind.
We specialize in Real-Time X-ray Inspection for electronic assemblies, PCB boards, and failure analysis. Here’s a look at the high-end equipment we use to screen your materials with precision.
Commitment to Quality
You can rest easy knowing every component has been thoroughly screened before it ever reaches your hands. Here’s where that peace of mind is built.
A destructive test using the latest laser decapsulation technology that replaces traditional chemical etching. Provides fast, accurate IC de-capsulation and de-lidding to expose internals from ceramic, KOVAR, gel, and mold compound capsulation — revealing defective bonding wires, solder ball positioning, lamination cracks, and other evidence of failure.
A destructive test to determine component leads/pads are free from oxidation and can still meet MIL-STD-883 and IPC-610 requirements.
Compromised moisture sensitive devices are subjected for baking to bring the components to a dry condition following OCM requirements and vacuum sealed with nitrogen purge system to flush out package moisture to protect and extend the life of moisture sensitive materials.
This ensures that components conform with OCM datasheet and MIL-STD-883 from packaging up to the component level utilizing the most advanced digital microscope with 20X~2500X magnification.
Widely considered as a non-destructive test following MIL-STD-883 used to verify internal condition of the lead frame, die condition and wire bonds.
XRF is a non-destructive analytical technique used to determine the elemental composition of materials mainly for RoHS compliance.