Earning Your Trust, One Component at a Time
With years of expertise, Omega GTI's Test Inspection Laboratory is your trusted partner for component authenticity verification. Our advanced in-house tools and counterfeit detection methods guarantee the integrity of your materials - ensuring seamless operations and peace of mind.
Real-Time X-Ray. Failure Analysis. Total Confidence.
We specialize in Real-Time X-ray Inspection for electronic assemblies, PCB boards, and failure analysis. You can rest easy knowing every component has been thoroughly screened before it ever reaches your hands. Here's a look at the high-end equipment we use to screen your materials with precision.
Where Peace of Mind Is Built
Decapsulation
A destructive test using the latest laser decapsulation technology that replaces traditional chemical etching - exposing internals to reveal defective bonding wires, solder ball positioning, lamination cracks, and other evidence of failure.
Solderability
A destructive test to determine that component leads/pads are free from oxidation and still meet MIL-STD-883 and IPC-610 requirements.
Baking & Vacuum Sealing
Moisture-sensitive devices are baked to a dry condition following OCM requirements, then vacuum sealed with a nitrogen purge system to flush out package moisture and extend material life.
Visual Inspection
Ensures components conform with OCM datasheet and MIL-STD-883 from packaging to component level using an advanced digital microscope with 20X-2500X magnification.
X-Ray Inspection
A non-destructive test following MIL-STD-883 used to verify the internal condition of the lead frame, die condition, and wire bonds.
Lead Finish / XRF Analysis
XRF is a non-destructive analytical technique used to determine the elemental composition of materials, mainly for RoHS compliance.
See Our Lab Capabilities in Action
A look at the equipment and people behind every verified shipment - from microscopy and real-time X-ray to XRF, decapsulation, and solderability.